View L3-220_4497977.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

FERRITE CHIP INDUCTORS
1. PART NO. EXPRESSION :
L3 SERIES
L3-47NK-10
(a) (b) (c) (d)
(a) Series code (b) Inductance code : 47N = 0.047uH (c) Tolerance code : K = 10%, M = 20%
(d) 10 : Lead Free
2. CONFIGURATION & DIMENSIONS :
A D L G
B
C
PCB Pattern Unit:m/m
A
B
C
D
G 1.00 Ref.
H 1.00 Ref.
H
L 3.00 Ref.
2.000.20 1.250.20 0.850.20 1.250.20 0.500.30
3. SCHEMATIC :
4. MATERIALS : b a
Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.)
(a) Body : Ferrite (b) Termination : Ag/Ni/Sn
5. GENERAL SPECIFICATION : a) Temp. rise : 30C Max. b) Rated current : Base on temp. rise c) Storage temp. : -40C to +85C d) Operating temp. : -40C to +85C e) Resistance to solder heat : 260C.10secs
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 1
FERRITE CHIP INDUCTORS
6. ELECTRICAL CHARACTERISTICS : Part Number L3-47N -10 L3-68N -10 L3-82N -10 L3-R10 -10 L3-R12 -10 L3-R15 -10 L3-R18 -10 L3-R22 -10 L3-R27 -10 L3-R33 -10 L3-R39 -10 L3-R47 -10 L3-R56 -10 L3-R68 -10 L3-R82 -10 L3-1R0 -10 L3-1R2 -10 L3-1R5 -10 L3-1R8 -10 L3-2R2 -10 L3-2R7 -10 L3-3R3 -10 L3-3R9 -10 L3-4R7 -10 L3-5R6 -10 L3-6R8 -10 L3-8R2 -10 L3-100 -10 L3-120 -10 L3-150 -10 L3-180 -10 L3-220 -10 L3-270 -10 L3-330 -10 EIA Size 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 0805 Inductance ( H ) 0.047 0.068 0.082 0.100 0.120 0.150 0.180 0.220 0.270 0.330 0.390 0.470 0.560 0.680 0.820 1.000 1.200 1.500 1.800 2.200 2.700 3.300 3.900 4.700 5.600 6.800 8.200 10.000 12.000 15.000 18.000 22.000 27.000 33.000 Q Min. 15 15 15 20 20 20 20 20 20 20 25 25 25 25 25 45 45 45 45 45 45 45 45 45 45 45 45 45 45 30 30 30 30 30 Test Frequency ( MHz ) 50 50 50 25 25 25 25 25 25 25 25 25 25 25 25 10 10 10 10 10 10 10 10 10 4 4 4 2 2 1 1 1 1 0.4 SRF ( MHz ) Min. 320 280 255 235 220 200 185 170 150 145 135 125 115 105 100 75 65 60 55 50 45 41 38 35 32 29 26 24 22 19 18 16 14 13
L3 SERIES
DC Resistance () Max. 0.20 0.20 0.20 0.30 0.30 0.40 0.40 0.50 0.50 0.55 0.65 0.65 0.75 0.80 1.00 0.40 0.50 0.50 0.60 0.65 0.75 0.80 0.90 1.00 0.90 1.00 1.10 1.15 1.25 0.80 0.90 1.10 1.15 1.25
Rated Current ( mA ) 300 300 300 250 250 250 250 250 250 250 200 200 150 150 150 50 50 50 50 30 30 30 30 30 15 15 15 15 15 5 5 5 5 5
Packaging : Paper Carrier Tape Inductance tolerance : : K : 10% M : 20%
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 2
FERRITE CHIP INDUCTORS
7. IMPEDANCE VS. FREQUENCY CURVES :
L3 SERIES
Q vs. Frequency FCI2012-Series Q vs Freq.
120 100 80
100
4R7 R1 0 1R0
Q
60 40 20 0 1
330
10
100
FREQUENCY(MHz)
L vs. L vs FCI2012-Series IDC IDC.
100
330
Indu ctance(uH)
10
100 4R7 1R2
1
R12
0.1 1 10 100 1000
DC Current (mA)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 3
FERRITE CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
L3 SERIES
ITEM
Electrical Characteristics Test Impedance DC Resistance Rated Current Temperature Rise Test
PERFORMANCE
TEST CONDITION
HP4291A, HP4287A+16092A
Refer to standard electrical characteristics list
HP4338B
30C max. ( t)
1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2605C Flux for lead free : rosin Dip Time : 100.5sec.
Solder Heat Resistance
No mechanical damage Remaining terminal electrode : 70% min.
Preheating Dipping 260C Natural cooling
150C
60 seconds
100.5 seconds
Solderability
More than 90% of the terminal electrode should be covered with solder.
Preheating Dipping 245C Natural cooling
Preheat : 150C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 2455C Flux for lead free : rosin Dip Time : 41sec.
150C
60 seconds
41.0 seconds
Terminal Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
For Z / L Series : Size 1 2 3 4 5 6 Force (Kfg) 0.2 0.5 0.6 1.0 1.0 1.0 1.5 2.0 > 25 Time (sec)
W
W
7 8
Flexture Strength
The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions.
20(.787) Bending 45(1.772) 45(1.772) 40(1.575)
Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return.
100(3.937)
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 4
FERRITE CHIP INDUCTORS
8. RELIABILITY & TEST CONDITION :
L3 SERIES
ITEM
Bending Strength
PERFORMANCE
The ferrite should not be damaged by forces applied on the right condition.
R0.5(0.02) 1.0(0.039)
TEST CONDITION
For Z / L Series : Series name 2 3 4 mm (inches) 0.80 (0.033) 1.40 (0.055) 2.00 (0.079) 2.70 (0.106) P-Kgf 0.3 1.0 2.5 2.5
Chip A
5 6 7 8
Random Vibration Test
Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed.
Frequency : 10-55-10Hz for 1 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular directions (Total 6 hours). No mechanical damage Temperature : 855C Applied Current : rated current Duration : 100812hrs Measured at room temperature after placing for 2 to 3hrs. Humidity : 90~95% RH. Temperature : 402C Duration : 100812hrs Measured at room temperature after placing for 2 to 3hrs.
Drop Loading at High Temperature
Drop 10 times on a concrete floor from a height of 75cm. Appearance : No damage. Inductance : Within 10% of initial value. Q : Within 30% of initial value.
Humidity
Thermal Shock
Appearance : No damage. Inductance : Within 10% of initial value. Q : Within 30% of initial value. Phase 1 2 Temperature (C) -402C +855C Times (min.) 303 303
For L Series : Condition for 1 cycle Step1 : -402C 303 min. Step2 : +855C 303 min. Number of cycles : 100 Measured at room temperature after placing for 2 to 3hrs. Temperature : -552C Duration : 100812hrs Measured at room temperature after placing for 2 to 3hrs. No mechanical damage
Low temperature storage test
Measured : 100 times
Drop
Drop 10 times on a concrete floor from a height of 75cm.
Derating Curve
Derated Current(A)
Derating
6 5 4 3 2 1 0 6A 5A 4A 3A 2A 1.5A 1A
For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve.
85
125
Operating Tem perature(C) Operating Temperature(X ) C
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 5
FERRITE CHIP INDUCTORS
9. SOLDERIND AND MOUNTING : 9-1. Recommended PC Board Pattern
2.60 0.60
L3 SERIES
9-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 9-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 9-2.2 Solder Wave : Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature seen by the circuit when immersed in the molten solder wave, typical at 230C. Due to the risk of thermal damage to products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown in Fig. 2 9-2.3 Soldering Iron (Figure 3) : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350C tip temperature (max) f) Limit soldering time to 3 secs. c) Never contact the ceramic with the iron tip
Preheating Soldering
10s max. 250 ~ 260 230 180 150
TEMPERATURE C
TEMPERATURE C
Natural cooling
0.80
PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure.
Preheating
260 245 150
Soldering
Natural cooling
60~120s
30~60s
Time(sec.) Figure 1. Re-flow Soldering
Over 2min.
Gradual Cooling Within 3s
Preheating
Soldering
3s (max.) 10s (max.)
TEMPERATURE C
Natural cooling
Figure 2. Wave Soldering
350 330 150
Over 1min.
Gradual Cooling
Figure 3. Hand Soldering
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 6
FERRITE CHIP INDUCTORS
L3 SERIES
9-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4.
Upper limit Recommendable
t
Figure 4
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 7
FERRITE CHIP INDUCTORS
10. PACKAGING INFORMATION : 10-1. Reel Dimension
A
L3 SERIES
Type 7" x 8mm
D B C
A(mm) 9.00.5
B(mm) 60.02.0 60.02.0
C(mm)
D(mm)
13.50.5 178.02.0 13.50.5 178.02.0
7" x 12mm 13.50.5
20.5
13.50.5 R10.5
7" x 8mm
7" x 12mm
R1.9
R0.5
120
10-2 Tape Dimension / 8mm Material : Paper
P2:20.1 E:1.750.1 Po:40.1 D:1.5 +0.1 -0.05 t
Series
W:8.00.1
Size 1
Bo(mm) 1.120.05 1.800.05 2.300.05
Ao(mm) 0.670.05 1.050.05 1.500.05
Ko(mm) 0.540.05 0.950.05 0.950.05
P(mm) 2.00.1 4.00.1 4.00.1
t(mm) 0.230.05 0.950.05 0.950.05
D1(mm) none none none
F:3.50.05
Bo
Z/L
2 3(09)
P
Ao
Ko
Material : Plastic
P2:20.05 E:1.750.1 Po:40.1 D:1.5+0.1 A W:8.00.1 t
Series
Size 2 3(09)
Bo(mm) 1.800.10 2.250.10 2.350.10 3.500.10 3.420.10
Ao(mm) 1.010.10 1.420.10 1.500.10 1.880.10 2.770.10
Ko(mm) 1.020.10 1.040.10 1.450.10 1.270.10 1.550.10
P(mm) 4.00.1 4.00.1 4.00.1 4.00.1 4.00.1
t(mm) 0.220.05 0.220.05 0.220.05 0.220.05 0.220.05
D1(mm) none 1.00.1 1.00.1 1.00.1 1.00.1
F:3.50.05
Bo
Z/L
3(12) 4 5
P
A D1:10.1
Ao
Ko
Section A-A
10-2.1 Tape Dimension / 12mm
D:1.5+0.1 E:1.750.1 A W:12.00.1 Po:40.1 P2:20.05 t
Series
Size 6
Bo(mm) 4.950.1 4.950.1 6.100.1
Ao(mm) 1.930.1 3.660.1 5.400.1
Ko(mm) 1.930.1 1.850.1 2.000.1
P(mm) 4.00.1 8.00.1 8.00.1
t(mm) 0.240.05 0.240.05 0.300.05
D1(mm) 1.50.1 1.50.1 1.50.1
F:5.50.05
Bo
Z/L
7 8
A D1:1.50.1
P
Ao
Ko
Section A-A
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 8
FERRITE CHIP INDUCTORS
L3 SERIES
10-3. Packaging Quantity Chip Size Chip / Reel Inner Box Middle Box Carton Bulk (Bags) 8 1000 4000 20000 40000 7000 7 1000 4000 20000 40000 12000 6 2000 8000 40000 80000 20000 5 2500 12500 62500 125000 30000 4 3000 15000 75000 150000 50000 3 (12) 2000 10000 50000 100000 100000 3 (09) 4000 20000 100000 200000 150000 2 4000 20000 100000 200000 200000 1 10000 50000 250000 500000 300000
10-4. Tearing Off Force F 165 to 180 Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions.
Room Temp. (C) 5~35 Room Humidity (%) 45~85 Room atm (hPa) 860~1060 Tearing Speed (mm/min) 300
Base tape
Application Notice
1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : 10 ~ 40C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized.
NOTE : Specifications subject to change without notice. Please check our website for latest information.
01.04.2008
SUPERWORLD ELECTRONICS (S) PTE LTD
PG. 9

▲Up To Search▲

Price & Availability of L3-220

	To Download L3-220 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .